Ballou/Feldmeier

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Scholarship Name: Ballou/Feldmeier

Deadline to Apply: April 1
GPA: 2.0
1st year:
2nd Year:
Duration: 1 Semester
Description: This award is given to students in the Surveying Technology Program.
Amount Awarded: $200
Criteria Checklist:

  • Must be enrolled in the Surveying Technology program

Application Process: Pick up applications in Academic Building 137 and contact the Center for Mathematics, Engineering, Physical Science and Applied Technology (STEM) or contact Institutional Advancement in Payne Hall 220 for a General MVCC application

Selection by Center for Mathematics, Engineering, Physical Science and Applied Technology (STEM)


MVCC Scholarships


 


Debra Edick
Administrative Assistant
Institutional Advancement


Contact Information
Payne Hall, Room 220
1101 Sherman Drive
Utica, NY 13501
Telephone - 315.792.5555
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